A new 3-D coordination polymer as a precursor for CuI-based thermoelectric composites

Shi Qiang Bai, Ivy Hoi Ka Wong, Nan Zhang, Karen Lin Ke, Ming Lin, David James Young, T. S.Andy Hor

Research output: Contribution to journalArticle

Abstract

Two complexes, [Cu6I6(L1)3]n (I) and [Cu4I4(L2)2]n (II) (L1 = 1,4-bis(phenylthio)but-2-yne; L2 = 1,4-bis(phenylthio)butane), as precursors for thermoelectric composites were prepared using a literature procedure. During the preparation of I, an unexpected 3-D polymorph [Cu4I4(L1)2]n (1) with a triclinic space group and an infinite [CuI]n staircase structure was obtained. This new polymorph (1) exhibited the same structure at both room temperature and 173 K. Complexes 1 and II were therefore pyrolysed to composites 2 and 3, respectively, at 400 °C under a nitrogen gas flow. Composite 3 was pale in color with a low carbon content (0.05 wt%) and easily disassembled during handling. By comparison, the high carbon containing (10.2 wt%) composite 2 can be compressed into a robust, light pellet (density 3.58 g cm−3), which showed a moderate to high Seebeck coefficient (543-1308 μV K−1) over the temperature range 70-240 °C.

Original languageEnglish
Pages (from-to)16292-16298
Number of pages7
JournalDalton Transactions
Volume47
Issue number45
DOIs
Publication statusPublished - 7 Dec 2018
Externally publishedYes

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    Bai, S. Q., Wong, I. H. K., Zhang, N., Lin Ke, K., Lin, M., Young, D. J., & Hor, T. S. A. (2018). A new 3-D coordination polymer as a precursor for CuI-based thermoelectric composites. Dalton Transactions, 47(45), 16292-16298. https://doi.org/10.1039/c8dt03219j