Thermal conduction in bi-layer materials with an interfacial inclusion

Baolin Wang, Jiecai Han

    Research output: Contribution to journalArticleResearchpeer-review

    Original languageEnglish
    Pages (from-to)241-249
    Number of pages9
    JournalPhilosophical Magazine Letters
    Volume90
    Issue number4
    Publication statusPublished - 2010

    Cite this

    Wang, Baolin ; Han, Jiecai. / Thermal conduction in bi-layer materials with an interfacial inclusion. In: Philosophical Magazine Letters. 2010 ; Vol. 90, No. 4. pp. 241-249.
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    author = "Baolin Wang and Jiecai Han",
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    language = "English",
    volume = "90",
    pages = "241--249",
    journal = "Philosophical Magazine Letters",
    issn = "0950-0839",
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    }

    Thermal conduction in bi-layer materials with an interfacial inclusion. / Wang, Baolin; Han, Jiecai.

    In: Philosophical Magazine Letters, Vol. 90, No. 4, 2010, p. 241-249.

    Research output: Contribution to journalArticleResearchpeer-review

    TY - JOUR

    T1 - Thermal conduction in bi-layer materials with an interfacial inclusion

    AU - Wang, Baolin

    AU - Han, Jiecai

    PY - 2010

    Y1 - 2010

    M3 - Article

    VL - 90

    SP - 241

    EP - 249

    JO - Philosophical Magazine Letters

    JF - Philosophical Magazine Letters

    SN - 0950-0839

    IS - 4

    ER -