Abstract
This manuscript explores the transformative potential of integrating Geospatial Artificial Intelligence (Geo-AI) and Augmented Reality (AR) technologies into interdisciplinary courses within the realm of interdisciplinary Earth science education. The convergence of Geo-AI and AR presents an innovative paradigm for immersive and interactive learning experiences, enhancing students' comprehension of complex geospatial concepts and developing cross-disciplinary collaboration. This manuscript delineates how these technologies can be effectively employed to simulate real-world Earth science scenarios, enabling students to explore geospatial data in three-dimensional, contextual environments. By combining the powers of Geo-AI and AR, educators have the potential to revolutionize Earth science education. This can empower students to improve essential skills in analyzing, interpreting, and tackling intricate geospatial issues through captivating and immersive learning experiences. The manuscript presented here is a valuable tool for educators, curriculum developers, and institutions dedicated to enriching interdisciplinary Earth science education by seamlessly incorporating Geo-AI and AR technologies.
Original language | English |
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Title of host publication | EDUCON 2024 - IEEE Global Engineering Education Conference, Proceedings |
Place of Publication | United States |
Publisher | IEEE Computer Society |
Pages | 1-5 |
Number of pages | 5 |
ISBN (Electronic) | 9798350394023 |
ISBN (Print) | 9798350394030 |
DOIs | |
Publication status | Published - 2024 |
Event | 15th IEEE Global Engineering Education Conference, EDUCON 2024 - Kos Island, Greece Duration: 8 May 2024 → 11 May 2024 |
Publication series
Name | IEEE Global Engineering Education Conference, EDUCON |
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ISSN (Print) | 2165-9559 |
ISSN (Electronic) | 2165-9567 |
Conference
Conference | 15th IEEE Global Engineering Education Conference, EDUCON 2024 |
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Country/Territory | Greece |
City | Kos Island |
Period | 8/05/24 → 11/05/24 |
Bibliographical note
Publisher Copyright:© 2024 IEEE.